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A term in the chip soldering industry describing a situation wherein a soldering defect causes a chip component to stand up on end (like a Tombstone), leaving one end soldered to the board and the other end free. It is caused during the reflow soldering process where non-uniform melthing causes an unbalanced force to be applied to the chip from the solder. For an exact definition, see the
'''Tombstoning''' is a term in the ] ] industry describing a situation wherein a soldering defect causes a chip component to stand up on end (like a ]), leaving one end soldered to the ] and the other end free. It is caused during the reflow soldering process where non-uniform melting causes an unbalanced force to be applied to the chip from the solder.
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Revision as of 08:00, 13 June 2005
Tombstoning is a term in the chipsoldering industry describing a situation wherein a soldering defect causes a chip component to stand up on end (like a tombstone), leaving one end soldered to the board and the other end free. It is caused during the reflow soldering process where non-uniform melting causes an unbalanced force to be applied to the chip from the solder.